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  • LED UV Curing Box
    Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box

    Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection

  • UV Curing System
    Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square

    Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

  • Wafer Expander Machine
    6 inch 8 inch Semi-automatic LED Wafer Expander Machine

    Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;

  • Semi-automatic Wafer Mounter Machine
    DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine

    This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.

  • Manual wafer tearing machine
    Manual Wafer Film Separator Silicon Stripping Machine

    This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

Solidified Camera Module, Installed Surveillance Camera

2021-03-13 11:16:54

Some camera module manufacturers used UV lamp irradiation curing before, the time is longer. In addition, the surface temperature of the camera assembly is higher after irradiation, which seriously affects the quality of their products. Therefore, they found us, Shenzhen Deshengxing Electronics Co., Ltd., to conduct special product testing.


365nm Ultraviolet Curing Equipment Bonding Camera Module


We knew that, in the production process of the security surveillance camera module, we need to use UV glue to fix the filters, lenses, CMOS components, etc. Because of using UV glue bonding, and the requirements of camera module is relatively high, it needs to use matched UV LED curing light source for curing and drying. And, because the volume of camera module is relatively small, we have given priority to choose Shenzhen Deshengxing Electronics Co., Ltd. UV LED Spot Light Source Equipment for product testing.


UV Spot Light Curing Equipment Curing Ink UV Glue

(overall / individual control)


After a series of comparative tests, the customer choose a custom UV LED spot light source equipment here for the curing UV glue. According to the test results, the surface temperature of the UV glue does not rise more than 5 ℃ after 5-10 seconds of UV irradiation, and the use of ordinary natural cooling irradiation head can meet the use requirements. Combined with actual using situation, we chose 1+4 UV LED spot light source curing machine to test. LED UV Curing Machine from Shenzhen Deshengxing Electronics Co., Ltd. not only greatly saves the curing time, but also the temperature of the camera module parts does not change basically. The curing effect of the UV glue is particularly good, which effectively solves the problems encountered by customers and achieves long-term cooperation opinions.


High Power LED UV Spot Light Drying Lamp Curing Systems

(1) medical products  (2) electronics  (3) components fixed

(4) LCD pre cured  (5) camera module


High Effective UV Spot Light Curing Lamp 365nm


(1) DVD/CD lens bonding irradiation

(2) lens and filter bonding irradiation

(3) digital lens IC bonding irradiation

(4) lens scoring bonding irradiation

(5) LCD/DLP optical

(6) liquid crystal main inlet seal and OLB enhancement

(7) small prism bonding

(8) hard disk, magnetic head bonding irradiation

(9) after core-adjusting, fiber optic connector parts bonding irradiation

(10) optical fiber color bonding irradiation

(11) photo-electric switch/special shaped parts bonding irradiation

(12) earphone voice coil bonding irradiation

(13) miniature motor parts bonding irradiation

(14) medical products bonding irradiation

(15) injecting needle fixation bonding irradiation

(16) compound bonding irradiation


UV LED Spot Light Curing System Industrial Drying

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