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  • NWSU333B 385NM
    NWSU333B 385NM, Original Genuine NICHIA Made in Japan, Ready Stock Available

    NWSU333B 385NM, Original Genuine NICHIA Made in Japan, Ready Stock Available

  • NICHIA 280nm UVC LED Chip NCSU434D
    NCSU434D NICHIA 280nm UVC LED

    NICHIA NCSU434D UVC LED 280nm 3535 High Power LED Chip 5.14W Disinfection Air Purification Surface Curing Light Source

  • Stripping Machine
    Custom 4-inch Wafer Film & Gold Layer Peeling Machine

    Custom 4-inch Wafer Film & Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications. We support OEM/ODM customization and tailored machine solutions according to different production requirements, helping customers improve efficiency and maintain consistent product quality.

  • China Top 10 12 inch Semi-automatic Film Wafer Laminating Machine Supplier
    12 inch Semi-automatic Film Wafer Laminating Machine

    The 12 Inch Semi-automatic Film Wafer Laminating Machine featuresheight adjustment, table heating, vacuum adsorption, and automatic film sticking, ensuring precise and stable lamination for semiconductor wafers. Its advanced design improves lamination accuracy and production efficiency while maintaining consistent performance. Withover 2000 successful cases, the machine has proven reliability and is widely trusted in wafer processing applications.

  • China Top 10 Custom Wafer Expander With the SameSize Grip Ring Supplier
QFN 12 inch Semi-automatic Wafer Laminating Machine for Square Frame Ring Customized QFN 12 inch Semi-automatic Wafer Laminating Machine for Square Frame Ring Customized

QFN 12 inch Semi-automatic Wafer Laminating Machine for Square Frame Ring Customized

Roller system, Micrometer to adjust thickness, Adjustable pressure, Vacuum heating function, Servo motor 400W

  • model no. :

    DSXUV-WM-C
  • Brand:

    DSXUV
  • Color :

    white
  • port of dispatch :

    Shenzhen
  • Payment :

    100% T/T before shipment
  • original region :

    China
  • Lead Time :

    20days
Product Details


External dimensions

L1450mm * W650mm * H497mm (please refer to the cutting plan for specific dimensions)


Size of machine:

1, Square frame ring: 380*330mm

2, Product release film

3, Product thickness: 0.2mm-10mm, the black side is combined with the film

Total Power:700W


Input power:100-240V AC, 50-60Hz

Atmospheric pressure: 0.5-0.8Mpa

Heating Temperature of the Chuck: 0-100 degrees

Film application operation method - manual loading and cutting, manual cross cutting

-Automated film,application with PLC display screen

-Adjustable pressure, with vacuum and adsorption functions


Workbench/Roller System

Aluminum plated with Teflon, micrometer adjustment range 0-15mm, suitable for product thickness.

The film/pressure roller automatically adapts to the thickness of the product (range 0-5mm).
Semi automatic wafer laminating machine

Configuration List

Servo motor 400W

Ball screw

Festo FESTO diaphragm clamping cylinder

Yadeke cylinder

Electromagnetic valve 4V21008B (Yadeke)

Chint Vacuum Generator CV-1013






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