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  • LED UV Curing Box
    Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box

    Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection

  • UV Curing System
    Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square

    Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

  • Wafer Expander Machine
    6 inch 8 inch Semi-automatic LED Wafer Expander Machine

    Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;

  • Semi-automatic Wafer Mounter Machine
    DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine

    This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.

  • Manual wafer tearing machine
    Manual Wafer Film Separator Silicon Stripping Machine

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Blue Film Stretch Machine Wafer laminating Machine Blue Film Stretch Machine Wafer laminating Machine

Blue Film Stretch Machine Wafer laminating Machine

Manual or Semi-automatic, Uniform membrane expansion, tension control,Support disco iron rings


 

  • model no. :

    DSXUV-WM6-B
  • Color :

    White
  • port of dispatch :

    Shenzhen
  • Payment :

    100% T/T before shipment
  • original region :

    China
  • Lead Time :

    15 days
Product Details

Wafer laminating machine Blue UV film wafer mounter machine BG QFN film laminator machine Customized glass filter semiconductor

1. Suitable for blue film, UV film, PET substrate film, and double-layer film.

2. Optional microporous film coating tray that can be applied to ultra-thin wafers.

3. The heated and elastic film coating tray design can adapt to wafers of different thicknesses.

4. Unique film roller pressure adjustable design.

5. Equipped with a circular knife and a cross cutting knife.

6. Optional ion air rod electrostatic removal device.

7. Small size, desktop placement type.
Bouncing film machine

Micro porous film coating tray suitable for ultra-thin wafers (optional):

The micro porous design of the film coating platform, combined with unique air path design and elastic support structure, can be applied to wafers, glass or ceramics with a minimum thickness of 100um; This structure and the roller device equipped with air flexible elasticity and adjustable elasticity can minimize the damage to ultra-thin wafers during film application and greatly reduce the probability of breakage.

Anti static PTFE surface treatment film table with heating function and elasticity:

The table design with heating and adjustable heating temperature range ensures that the adhesive effect of the film can be adjusted to the ideal state.

The elastic platform can adapt to wafers, glass, or ceramics of different thicknesses.

The surface anti-static PTFE treatment not only minimizes the static electricity generated during film application, but also effectively prevents physical scratches on the chip.

Suitable for standard 6-inch frame rings

6 inch frame ring




Model

DSXUV-WM6-B

Size

6-inch, ID228mm, OD194mm

Overall size

L1021×W490xH613mm

Input power

100-240V AC 50-6OHZ

Total power

500W

Air pressure

0.5~O.8Mpa

Workbench lifting height


0-30mm (PLC display screen set as needed)


Type film


Blue film/UV film (note: this machine is compatible with a film width of 270mm)

Heating temperature of the tray

O~1OOC

Film thicknes

0.06-0.17mm

(For reference only)

Film function


Manual loading and unloading, automatic lifting


Film cutting function

Manual rotating type

Waste film recycling

Automatic recycling of UV film release paper

operating mode

Touch screen combined with buttons to achieve manual/semi-automatic operation

Function


Without product stretch film, the film expands and tightens,
covering the iron ring steel ring. It can be accurately set on the display screen, and the height of the working disc can be raised

Warranty period

one year
wafer laminating machine


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