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New Products
  • LED UV Curing Box
    Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box

    Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection

  • UV Curing System
    Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square

    Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

  • Wafer Expander Machine
    6 inch 8 inch Semi-automatic LED Wafer Expander Machine

    Equipped with nitrogen support rod, clamshell labor-saving function; Adjust the height of the working plate to rise, you can adjust the spacing between the DIE; Using the motor lifting and cylinder lifting to complete the membrane expansion process, to ensure the consistency of the membrane expansion;

  • Semi-automatic Wafer Mounter Machine
    DSXUV 12inch Semi-automatic Wafer Mounter Film Sticking Machine

    This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.

  • Manual wafer tearing machine
    Manual Wafer Film Separator Silicon Stripping Machine

    This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

Shenzhen Deshengxing Electronics Co., Ltd. specializes in the R&D and manufacturing of wafer processing equipment, including UV Tape Degumming Machines, Wafer Mounter Machines, Wafer Expander Machines, Wafer Tape Peeler Machines, and UV LED Curing Systems. We provide high-precision equipment solutions to support semiconductor, photovoltaic, flat-panel display, and electronics manufacturing applications.




With extensive industry experience and continuous innovation capabilities, we focus on core equipment such as UV debonding and wafer mounting systems, integrating advanced automation and precise process control. Our systems are designed to ensure stable performance, consistent quality, and improved production efficiency across wafer handling workflows.


Driven by customer requirements, we continuously optimize product performance and offer customizable configurations to meet different production environments and process standards. Our solutions have been successfully deployed in over 3,000 projects worldwide, covering major IC manufacturing regions including Malaysia, Singapore, the United States, Europe, Israel, South Korea, and Taiwan.




We adhere to an innovation-oriented and sustainable development philosophy, investing in R&D to maintain technological leadership while optimizing manufacturing processes to reduce energy consumption and environmental impact.


Backed by a professional technical support team, we provide full-service assistance, including equipment selection, process debugging, and after-sales maintenance. We have established long-term, stable cooperation with numerous customers and continue to support their production scaling and process upgrading.




If you are seeking a reliable wafer equipment partner, Deshengxing Electronics is ready to support your manufacturing needs and long-term growth.

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