2018-03-16
(conyinute UV LED Reliability Research (Ⅰ))
Product |
Structure Layer |
Heat Conductivity Coefficient |
Thickness (mm) |
Area (mm2) |
Thermal Resistance (℃/W) |
Thermal Resistance of % |
COB |
Solid Crystal Silver Glue Layer |
30 |
0.01 |
1 |
0.333 |
2.53 |
Copper Wire Level |
401 |
0.1 |
16 |
0.016 |
0.12 |
|
Insulating Layer BT |
1.0 |
0.2 |
16 |
12.500 |
94.98 |
|
Copper Substrate |
401 |
2 |
16 |
0.312 |
2.37 |
|
Total |
- |
- |
- |
~13.2 |
100.00 |
|
DOB |
Solid Crystal Silver Glue Layer |
30 |
0.01 |
1 |
0.333 |
31.96 |
Gold Layer |
317 |
0.05 |
16 |
0.010 |
0.96 |
|
AIN Ceramic |
150 |
0.5 |
16 |
0.208 |
19.96 |
|
Solder Paste Layer |
51 |
0.1 |
16 |
0.123 |
11.80 |
|
Copper Substrate |
401 |
2.3 |
16 |
0.358 |
34.36 |
|
Total |
- |
- |
- |
~1.0 |
100.00 |
Ⅳ、Summarize
From UV LED discrete devices and integrated module two aspects carries on the analysis shows that, the transmittance (UV light), air tightness, from several aspects, such as electrical and thermal performance, inorganic packaging materials is better than the organic packaging materials. Therefore, the use of organic material for UV LED devices and module is only suitable for occasions with low requirements on power and life, etc., and based on the CMH encapsulation technology of inorganic UV LED devices and module can adapt to various occasions of printing industry.