Semiconductor Wafer Cleaving Machine GPP Wafer Laser Cutting

Semiconductor Wafer Splitter Device is widely used for Wafer Cleaving, Cutting Stripes / Dies, Crystal Axis Cutting, Glass and Sapphire Cutting, PCB Board Cutting, Irregular Sample Cutting.

Characteristics:

1.PLC control, easy operation, single button control

2.With red light indicator function

3.The pressure is adjustable

4.Manually place and take the film

5.Special segment rubber pad

Introduction:

1.Wafer Breaker is controlled by PLC.

2.The driving motor adopts stepper motor

3.The movement in the Y direction is positioned by the guide rail and driven by the synchronous belt

4.The height positioning in the Z direction is driven by the screw module, and the downward pressure is controlled by the Z downward pressure distance and conducted by the spring

5.A red light is set to indicate the direction of placement of the silicon groove

6.Semi-automatic Wafer breaker replaces the manual use of roller cleaving action

7.Equipped with pressure sensor and digital display meter

8.Cleaving wafer is 5inch (with 6inch steel ring)

9.Roller stainless steel 8mm, 15mm, and 18mm, each for one piece

10.Indicator light is green