1. Semi automated operation

Human machine collaboration: The core membrane expansion process is automatically completed by machinery (such as film stretching, wafer fixation), but steps such as loading and unloading, parameter setting, etc. require manual participation.

Operational flexibility: Suitable for small batch and multi variety production, easy to adjust parameters (such as tension and speed) to meet different process requirements.

2. Simple structure and low cost

Compact design: Compared to fully automatic equipment, the mechanical structure and control system are simplified, the footprint is small, and it is suitable for small and medium-sized enterprises or laboratories.

Low investment threshold: The initial procurement and maintenance costs are significantly lower than those of fully automatic models, making it suitable for scenarios with limited budgets.

3. High precision and stability

Uniform film expansion: By using precision mechanical structures such as servo motors and ball screws, the film is stretched evenly to avoid wafer breakage or displacement.

Tension control: The adjustable tension system prevents the film from being too tight or too loose, ensuring cutting quality.

4. Strong compatibility

Multi size adaptation: Supports wafers of different sizes (usually frame rings of the same size can be compatible with wafers smaller than 6 inches), and can be quickly switched by changing fixtures or carriers.

Diversity of film materials: compatible with blue film, UV film and other materials, some models support temperature adjustment (such as heating platform for UV film curing).

5. Safety protection design

Emergency braking: equipped with an emergency stop button, safety light barrier or sensor to prevent equipment or wafer damage caused by operational errors.

Anti pressure injury mechanism: The mechanical component design avoids the risk of hand clamping and complies with industrial safety standards.

6. Easy to maintain and low energy consumption

Modular components: Key components such as pneumatic components and guide rails are easy to disassemble and maintain, reducing downtime.

Low energy consumption: Semi automated structures typically have lower power consumption and controllable operating costs.

The semi-automatic wafer expansion machine is a key equipment in semiconductor packaging and cutting processes, mainly used for thin film expansion (such as blue film, UV film, etc.) before wafer cutting to ensure stable and non displaced grains during the cutting process