Support simultaneous film application on multiple chuck, Anti static heating table and vacuum adsorption product positioning function, Support square frame rings, Cutting film saving design,The chuck height can be adjusted

Semi‑automatic wafer mounter compatible with 6",8",12" wafer & electronic glass. Supports blue film & UV film lamination & peeling. Heated vacuum platen, high accuracy, low breakage rate, >60 PCS per hour for semiconductor thinning process.

Black anti-static teflon chuck, The height of chuck can be adjusted, and products with a thickness of 150-750um can be attached, No bubbles, No wrinkles, Easy to operate,Accept customization

8 inch manual wafer mounter, heated vacuum wafer mounter, vacuum adsorption glass laminator, 0-120℃ wafer film mounting machine, desktop wafer mounter DSX-26-088, manual dicing film laminator for glass substrate

365nm UV LED Nitrogen Debonding Equipment，For 10 Inch Frame Nitrogen UV Debonding Machine Multi-Size Wafer UV Tape Curing Machine.N2 Filled UV Debonder Machine, Industrial Wafer UV Film Removing Oven For Semiconductor Dicing Process.