This semi-automatic wafer expanding machine (MODEL :DSX26-052) is designed to expand die grains mounted on a 10-inch Frame ring and transfer them onto an 8-inch Frame ring.

8 Inch Manual Wafer Expander DSXUVEPMANUL8 Semiconductor Dicing Film Stretching Machine for 10 Inch Grip  Ring

NWSU333B 385NM, Original Genuine NICHIA Made in Japan, Ready Stock Available

NICHIA NCSU434D UVC LED 280nm 3535 High Power LED Chip 5.14W Disinfection Air Purification Surface Curing Light Source

Custom 4-inch Wafer Film & Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications. We support OEM/ODM customization and tailored machine solutions according to different production requirements, helping customers improve efficiency and maintain consistent product quality.