8-inch TAIKO Semiconductor Wafer Film Tearing Machine Protective Film Peeling Equipment

The DSXUV 6 inch frame film manual wafer tearing machine is equipped with a high-precision ceramic chuck to ensure stable wafer fixation during operation. Designed for manual film tearing, it offers reliable performance and precise control. This machine is suitable for semiconductor wafer processing and packaging applications.

Custom 4-inch Wafer Film & Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications. We support OEM/ODM customization and tailored machine solutions according to different production requirements, helping customers improve efficiency and maintain consistent product quality.

Fast Speed UV Coating Curing Machine is a small size facility. It can be controlled by remote controller.

LED Chip Packaging Industry Nitrogen Curing Box, Fast and Uniform Curing of UV Glue, 5 Seconds Curing, Leaving No Residual Adhesive.

Semiconductor specific 6-inch PP wafer boat box/anti-static flower basket 25 wafer packaging box, both horizontal and vertical transportation storage box, 6-inch octagonal box

This Wafer Mounter Machine Compatible with Laminator and Grinding Functions, Heating Chuck, Adjustable Chuck, Equipped with Round Cutters and Cross Cutters, Suitable for Wafers of Different Thicknesses. The Film is Guaranteed to Have No Bubbles, No Residual UV film, No Curling Edges, and No Wrinkles.