8-inch TAIKO Semiconductor Wafer Film Tearing Machine Protective Film Peeling Equipment

The DSXUV 6 inch frame film manual wafer tearing machine is equipped with a high-precision ceramic chuck to ensure stable wafer fixation during operation. Designed for manual film tearing, it offers reliable performance and precise control. This machine is suitable for semiconductor wafer processing and packaging applications.

Custom 4-inch Wafer Film & Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications. We support OEM/ODM customization and tailored machine solutions according to different production requirements, helping customers improve efficiency and maintain consistent product quality.

Deep UVC UV Sterilizer Light has been applied in various civil and military scenarios such as Surface Sterilization, Water Sterilization, Ultraviolet Phototherapy, Air Purification, etc.

Semiautomatic Semiconductor Wafer Breaker is controlled by PLC, replaces the manual use of roller cleaving action.

NICHIA 3535 UV LED Light Beads Aluminum Substrate is matched with NCSU276A and NVSU233B NICHIA LED.

NICHIA 6w Original Source UV Flashlight is made up with three-stage hard oxidation shell of aluminium alloy, inside Japan NVSU233A 5w 365nm UV LED. It's special in detecting amber, jade, cioin,etc..