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Custom 4-inch Wafer Film & Gold Layer Peeling Machine
Custom 4-inch Wafer Film & Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications. We support OEM/ODM customization and tailored machine solutions according to different production requirements, helping customers improve efficiency and maintain consistent product quality.
12 inch Semi-automatic Film Wafer Laminating Machine
The 12 Inch Semi-automatic Film Wafer Laminating Machine featuresheight adjustment, table heating, vacuum adsorption, and automatic film sticking, ensuring precise and stable lamination for semiconductor wafers. Its advanced design improves lamination accuracy and production efficiency while maintaining consistent performance. Withover 2000 successful cases, the machine has proven reliability and is widely trusted in wafer processing applications.
Custom Wafer Expander With the SameSize Grip Ring
Small Wafer Nitrogen UV Curing System Tape LED UV Curing Box
Nitrogen UV Curing System Tape Led,Compact and Practical UV Curing system, 5 seconds for The Film to Detach from The Wafer, Adjustable Time, Adjustable illumination, Nitrogen Protection
Wafer UV Curing System LED Tape UV Curing Machine Semiconductor Ceramic Substrate Square
Illumination can be adjusted, Time can be adjusted, Even Curing, 5 seconds Curing,Compatible with multiple sizes

8-inch TAIKO Semiconductor Wafer Film Tearing Machine Protective Film Peeling Equipment

Vacuum Adsorption, Heating Platform, Tear Film Without Fragmentation, Ion Wind Static Electricity

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Product Details

Applicable Wafer Size: Standard sizes are 6 inches, 8 inches, 12 inches, and can be customized according to customer requirements

Thickness: Complies with TAIKO wafer standards (usually 725um)

Tearing Method: Manual

Tearing Direction: Unidirectional or Bidirectional

Power requirements:

1-Voltage: 110-220V, supports customization

2-Frequency: 50/60Hz

3-Power: Approximately 200W

4-Air pressure: 0.4-0.6MPa

5-Interface: 8mm tube

Operating Environment:

Temperature: 20-25 degrees

Humidity: 40-60% RH

Teflon Porous Chuck, Microporous Ceramic Chuck Can Be Customizable

Related Tags : Wafer Tear Film Machine Wafer Film Peel Off Machine TAIKO Wafer Tearing Machine Manual Film Tearing Machine Wafer Tearing Machine Wafer Film Tearing System

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