Vacuum Adsorption, Heating Platform, Tear Film Without Fragmentation, Ion Wind Static Electricity
model no. :
DSXUV-TFBrand:
DSXUVColor :
Whiteport of dispatch :
ShenzhenPayment :
T/Toriginal region :
ChinaLead Time :
15days
Applicable Wafer Size: Standard sizes are 6 inches, 8 inches, 12 inches, and can be customized according to customer requirements
Thickness: Complies with TAIKO wafer standards (usually 725um)
Tearing Method: Manual
Tearing Direction: Unidirectional or Bidirectional
Power requirements:
1-Voltage: 110-220V, supports customization
2-Frequency: 50/60Hz
3-Power: Approximately 200W
4-Air pressure: 0.4-0.6MPa
5-Interface: 8mm tube
Operating Environment:
Temperature: 20-25 degrees
Humidity: 40-60% RH
Teflon Porous Chuck, Microporous Ceramic Chuck Can Be Customizable

The DSXUV 6 inch frame film manual wafer tearing machine is equipped with a high-precision ceramic chuck to ensure stable wafer fixation during operation. Designed for manual film tearing, it offers reliable performance and precise control. This machine is suitable for semiconductor wafer processing and packaging applications.
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