8-inch TAIKO Semiconductor Wafer Film Tearing Machine Protective Film Peeling Equipment

The DSXUV 6 inch frame film manual wafer tearing machine is equipped with a high-precision ceramic chuck to ensure stable wafer fixation during operation. Designed for manual film tearing, it offers reliable performance and precise control. This machine is suitable for semiconductor wafer processing and packaging applications.

Custom 4-inch Wafer Film & Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications. We support OEM/ODM customization and tailored machine solutions according to different production requirements, helping customers improve efficiency and maintain consistent product quality.

NICHINA 3535 Light Bead Copper Substrate, diameter 16mm thickness 1.6mm, NCSU276A and NVSU233A and NVSU233B can be used like this welding foot universal.

This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

Air Cooling LED UV Curing Light Source is a simple equipment stracture. Usually, it would not produce harmfui ultraviolet radiation without thermal radiation, and would reduce the heat generated by the curing process.