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8-inch TAIKO Semiconductor Wafer Film Tearing Machine Protective Film Peeling Equipment

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8-inch TAIKO Semiconductor Wafer Film Tearing Machine Protective Film Peeling Equipment 8-inch TAIKO Semiconductor Wafer Film Tearing Machine Protective Film Peeling Equipment

8-inch TAIKO Semiconductor Wafer Film Tearing Machine Protective Film Peeling Equipment

Vacuum Adsorption, Heating Platform, Tear Film Without Fragmentation, Ion Wind Static Electricity

  • model no. :

    DSXUV-TF

  • Brand:

    DSXUV

  • Color :

    White

  • port of dispatch :

    Shenzhen

  • Payment :

    T/T

  • original region :

    China

  • Lead Time :

    15days
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Product Details

Applicable Wafer Size: Standard sizes are 6 inches, 8 inches, 12 inches, and can be customized according to customer requirements



Thickness: Complies with TAIKO wafer standards (usually 725um)

Tearing Method: Manual

Tearing Direction: Unidirectional or Bidirectional

Power requirements:

1-Voltage: 110-220V, supports customization

2-Frequency: 50/60Hz

3-Power: Approximately 200W

4-Air pressure: 0.4-0.6MPa

5-Interface: 8mm tube

Operating Environment:

Temperature: 20-25 degrees

Humidity: 40-60% RH

Teflon Porous Chuck, Microporous Ceramic Chuck Can Be Customizable
Wafer Tear Film Machine

Wafer film tearing effect


Certificate of wafer laminating machine


Related Tags : Wafer Tear Film Machine Wafer Film Peel Off Machine TAIKO Wafer Tearing Machine Manual Film Tearing Machine Wafer Tearing Machine Wafer Film Tearing System
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