Product

Structure Layer

Heat Conductivity Coefficient

Thickness (mm)

Area (mm²)

Thermal Resistance (℃/W)

Thermal Resistance of %

COB

Solid Crystal Silver Glue Layer

30

0.01

1

0.333

2.53

Copper Wire Level

401

0.1

16

0.016

0.12

Insulating Layer BT

1.0

0.2

16

12.500

94.98

Copper Substrate

401

2

16

0.312

2.37

Total

-

-

-

~13.2

100.00

DOB

Solid Crystal Silver Glue Layer

30

0.01

1

0.333

31.96

Gold Layer

317

0.05

16

0.010

0.96

AIN Ceramic

150

0.5

16

0.208

19.96

Solder Paste Layer

51

0.1

16

0.123

11.80

Copper Substrate

401

2.3

16

0.358

34.36

Total

-

-

-

~1.0

100.00