Abstract

UV LED Light Source, compared with the traditional UV light source, has the advantages of environmental protection, low power consumption and band selection. The application of UV LED in printing industry always has many challenges, its reliability issue is particularly acute. The organic materials have the properties of poor UV resistance and high permeability, which the deterioration of its performance will greatly reduce the reliability of UV LED. Based on CMH packing technology, inorganic High Efficiency  UV-LED for UV Printing is 100% used inorganic materials packing, with good air tightness, high reliability, long life and low thermal resistance. Because the model of COB and DOB are different of encapsulated material and manufacturing technique, there is a big difference between the performance and reliability of the two. The thermal resistance of the insulation layer of the substrate has a great proportion to the total thermal resistance of COB, and the thermal resistance of the welding interlayer has great influence on the DOB.

According to different encapsulated material, UV LED discrete part is divided into organic material packing UV LED and inorganic material packing UV LED. Organic material packing UV LED is still used visible light LED device packing. UV LED chip will be coated organic encapsulated material, like epoxy resin, organic silicone, etc.. On the other hand, the product will use organic material as light cup of UV LED device, like EMC series of products in the market. However, inorganic material packing UV LED has improved, aim at ceramics as light up, glass or metal glass as cover plate. In the material properties, the organic material and inorganic material have the big difference. Both are used in UV LED packing. But for properties, lifetime and reliability of the whole device has big difference in influence. In order to facilitate the discussion, organic materials are represented by organic silica gel, and the inorganic materials are represented by glass, and the two are compared in the following aspects.