Semiconductor Wafer Chip Grip Ring Plastic Hoops Rings for Wafer Handling

Wafer Die Grip Rrings are made of glass-fiber-reinforced polycarbonate and can be configured as a set of inner and outer rings.Plastic Wafer Expander Rings can be used in semiconductor and LED chip, consisted of inner and outer ring. A reinforced plastic double grip rings are consist of inner and outer rings.Wafer Tape Expansion Rings able to fix wafer to let it expand, provide variety of specs for customer to choose.

Used for :

In-Line Wafer Handling on Expander Rings

Wafer Back Grinding

Wafer Mounting

Wafer Die Sort

Wafer / Die Pick & Place

Wafer / Die Shipping

Wafer expansion after dicing.

Replaces metal dicing frames.

Wafer/film attachment jig

Advantages:

1.  Prevents tapes and films from tearing or breaking.

2.  Eliminates the need to check the direction of the grip ring.

3.  Allows even unskilled operators to do work safely.

4.  The grip rings have no sharp edges that would hurt hands or fingers.

5.  Further, prevent tapes and films from tearing or breaking by eliminating projections (gate) caused by plastic injection.

6.Infinite use without deformation

Features:

- Grip (expander) rings have been designed and produced to exacting tolerances

- Our grip rings are exceptionally strong; made of fiber-reinforced polycarbonate, allowing the rings to better maintain their circular shape

- Dimple marks located on one side of both inner and outer rings provide quick and easy confirmation of correct orientation of grip ring positioning

- Low cost and engineered to last

- Available in red and yellow

-The reusable rings are easy to remove.