-
Nitrogen UV Curing Systems Multiple 6 inches Wafer Dicing MachineCuring multiple 6 inches UV Wafer at the same time, UV Film Tape Curing Systems reduce the adhesive strength of all UV-sensitive dicing tapes under controlled environment.
-
Full Automatic Nitrogen UV Tape Curing Machine Separate UV Film from Wafer Semiconductor365nm UV LED Box Type Curing Machine can be applied to all kind of UV tape debonding (for example, 6/8/12 inches wafer). Special box design to avoid UV leakage.
-
Multiple Silicon Wafer UV LED Curing System Machine Separated UV Tape from Wafer SemiconductorLED UV curing systems for reducing the adhesive strength of UV sensitive dicing tapes, effective UV 365nm, holds wafers up to 310mm