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12inch Semiautomatic Semiconductor Wafer Die Matrix Expander 12inch Semiautomatic Semiconductor Wafer Die Matrix Expander

12inch Semiautomatic Semiconductor Wafer Die Matrix Expander

12inch Wafer Film Expander is a direct pressure grain expansion separation equipment, suitable for various wafer thicknesses.

  • model no. :

    Wafer Film Expander
  • Brand:

    DSXUV
  • port of dispatch :

    Shenzhen
  • Payment :

    T/T 100% before shipment
  • original region :

    China
Product Details

12inch Wafer Film Expander is a direct pressure grain expansion separation equipment, suitable for various wafer thicknesses, widely used for UV tape blue film PVC film.

Under normal circumstances, it is used for wafer frame ring expansion to wafer crystal ring, and can also be customized according to customer requirements. Welcome to consult the wafer expander.


Parameters:

Name

Semiautomatic Wafer Expander

Model

DSXUV-WE-S12

Dimension

L625 x W712 x H1042mm

Size for

12inch wafer and below

Hoop Ring

Frame Ring

OD 347  ID 330 mm

OD 380.4  ID 177.76mm

Power

500W

Working plate rising height

10-70mm

Voltage

AC 220V, 50/60HZ

Table heating temperature

Indoor Temperature ~ 80

(thermostatic design)

Air Pressure

0.3-0.8Mpa

Film Type

Blue film, UV tape, PVC

Thickness of Film

0.05-0.2mm

Cutting

Serrated Blade Knife (0-15mm)

Control Mode

Semiautomatic / Manual

Weight

About 110KG

Warranty

New products, non-human damage, the whole machine warranty one year


Technological Requirements:

Expanding Size

Standard 6inch Frame Ring

Expanding Film Quality

There is no collapsing film, broken film, and the error of the center of the product after film expansion is within ±2mm

X and Y direction deviation of the film expansion

mm (eliminate bias in wafer placement when laminating)

Frame ring and hoop ring can be fixed

Fitted with dowel pins for placing frame ring

Constant temperature design of working disc

Perimembrane expansion is uniform and moderate

Function

Heating temperature, expansion time and speed are adjustable

Characteristics

Work disk does not squeeze the wafer during lifting/drop


Advantage:

1.Height and speed of the film can be set digitally via the touch screen

2.Working disc has a constant temperature heating function, which contributes to the ductility of the film

3.Distance between grains can be adjusted by adjusting the height of the working disk

4.Lower serrated knife automatic film cutting function

5.5 inch touch screen, display parameters, execution steps, fault alarm

6.Motor lifting and cylinder lifting are used to complete the film expanding process to ensure the consistency of film expanding

7.Using PLC as the control system, you can set the preheating delay of the table rising, the film expansion delay and other functions to better improve the quality of the film expansion


Semi-Automatic Wafer Film Expander

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You can contact us any way that is convenient for you. We are available 24/7 via, email or telephone.

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