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6inch Semiautomatic Wafer Expander for UV Tape Blue Film Expansion 6inch Semiautomatic Wafer Expander for UV Tape Blue Film Expansion 6inch Semiautomatic Wafer Expander for UV Tape Blue Film Expansion

6inch Semiautomatic Wafer Expander for UV Tape Blue Film Expansion

6 inch Semi-automatic Die Matrix Expander is widely used in wafer UV tape blue film expansion, frame ring to hoop ring, customized.

  • model no. :

    Wafer Die Matrix Expander
  • Brand:

    DSXUV
  • port of dispatch :

    Shenzhen
  • Payment :

    T/T 100% before shipment
  • original region :

    China
Product Details

Standard 6inch Semiautomatic Semiconductor Wafer Tape Expander has 6inch/8inch/12inch, customer can customize the device according to the requirements. Common specification is frame ring to hoop ring.


Parameters:

Name

Semiautomatic Wafer Expander

Model

DSXUV-WE-S6

Dimension

L600 x W510 x H1003mm

Size for

6inch wafer and below

Hoop Ring

OD 152 ID 141 mm

Power

500W

Working plate rising height

10-70mm

Voltage

AC 220V, 50/60HZ

Table heating temperature

Indoor Temperature ~ 80

(thermostatic design)

Air Pressure

0.3-0.8Mpa

Film Type

Blue film, UV tape, PVC

Thickness of Film

0.05-0.2mm

Cutting

Serrated Blade Knife (0-15mm)

Control Mode

Semiautomatic / Manual

Weight

About 85KG

Warranty

New products, non-human damage, the whole machine warranty one year


6inch hoop ring work plate


Technological Requirements:

Expanding Size

Standard 6inch Frame Ring

Expanding Film Quality

There is no collapsing film, broken film, and the error of the center of the product after film expansion is within ±2mm

X and Y direction deviation of the film expansion

mm (eliminate bias in wafer placement when laminating)

Frame ring and hoop ring can be fixed

Fitted with dowel pins for placing frame ring

Constant temperature design of working disc

Perimembrane expansion is uniform and moderate

Function

Heating temperature, expansion time and speed are adjustable

Characteristics

Work disk does not squeeze the wafer during lifting/drop


Advantage:

1.Height and speed of the film can be set digitally via the touch screen

2.Working disc has a constant temperature heating function, which contributes to the ductility of the film

3.Distance between grains can be adjusted by adjusting the height of the working disk

4.Lower serrated knife automatic film cutting function

5.5 inch touch screen, display parameters, execution steps, fault alarm

6.Motor lifting and cylinder lifting are used to complete the film expanding process to ensure the consistency of film expanding

7.Using PLC as the control system, you can set the preheating delay of the table rising, the film expansion delay and other functions to better improve the quality of the film expansion


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