Semiconductor Double Film Wafer Chip Laminating Machine

Semiconductor Wafer Chip Processing System can place UV tape and blue film at the same time for using.

Wafer film laminator, semiconductor chip wafer film machine, our company specializes in the development of various wafer film laminator, support custom, welcome to consult.

Standard model:

DSXUV-TapeM-6 is suitable for 6inch wafer chip

DSXUV-TapeM-8 is suitable for 8inch wafer chip

DSXUV-TapeM-12 is suitable for 12inch wafer chip

Note: If you need other requirements, please feel free to contact our service: uvcure@uvspacelight.com

Function:

1.Suitable for blue film, UV tape, PET substrate film, double layer film

2.Optional micro-porous laminating table for ultra-thin wafers

3.The heated and elastic laminating table is designed to adapt to wafers of varying thickness

4.Unique film roller pressure adjustable design

5.Equipped with circular knife and cross cutting knife

6.Optional electrostatic removal device for ion wind bar

7.Small size, tabletop layout

Anti-static Teflon surface treatment with heating and elasticity

The table design with heating and adjustable heating temperature range ensures that the adhesive effect of the film can be adjusted to the ideal state.

The elastic table adapts to wafers, glass or ceramics of different thicknesses

The antistatic Teflon treatment of the surface not only minimizes the static electricity generated during the coating, but also effectively prevents physical scratches on the chip.