Wafer Laminating Machine 8-inch Compatible Pre Cutting Laminating Without Bubble Vacuum Adsorption, Suitable for various blue and UV films, No bubbles (excluding broken bubbles), Have Temperature Controller for Heated Chucks and Vacuum Pump.

This equipment (lamator) is mainly used for 12 inch Si wafer BG film coating. No burrs, no bubbles. The wafer type is dummy wafer. This semi-automatic film sticking machine is suitable for applying film to products such as wafers, semiconductors, ceramics, and glass. It is a device used for film coating processing, specifically designed to precisely adhere thin film materials to the surface of wafers. It combines the characteristics of manual operation and automatic control, providing higher film application accuracy and efficiency while maintaining operational convenience.

Chip inversion machine can be used to transfer wafers from one film to another (such as UV film, blue film, optical film, etc.). This can be used to manufacture devices with specific functions, such as optical devices, sensors, and microelectronic components

This film tearing machine is used to remove the protective tape on the surface of wafers after thinning or etching processes. The device can be used for film tearing on 4 ", 5", 6 ", 8", and 12 "wafers.

Manual film tearing machine, suitable for tearing 6-inch small flat edge SIC wafer film. The main body of the machine is made of stainless steel and aluminum alloy, with stable performance and simple operation.