About the principle and use of UV film

When cutting semiconductor chips, placing the chip on the film can keep the grain intact in the cutting. Reduce the breakage caused by cutting. Ensure that the grain will not shift and drop during the normal transmission. No residuals, proper expansion. Grain is easy to remove. Water does not penetrate between grain and tape.

Applications of UV film :

1.For wafer cutting

2.Used to protect the integrity of the chip

3.Used for wafer turnover and transportation

However, when bonding the chip, the LED chip on the ordinary film generally has a large adsorption force, which is not easy to absorb. But the use of UV film can reduce film’s adsorption force through UV irradiation, so as to easily fall off.

Principle of UV film :

Add light initiator in a specially formulated resin (or photosensitizer), through the absorption of ultraviolet (UV) photolysis glue machine equipment of high intensity of UV light, active free radicals or iron, causing polymerization, cross-linking and grafting reaction, the resin (UV coating, printing ink, adhesive, etc.) in seconds (range) from liquid into solid, remove viscous.